Schleichfahrt
creep
Description:
Creep is a process of slow but continuous Plastic deformation in a Material under a static load. It occurs in particular at high temperatures, because the higher energy supply facilitates diffusion processes. The deformation that occurs still depends on the component's material properties. Key creep parameters include the creep modulus ${{E}_{c}}$ and the creep value $\varphi$. These parameters depend on the material's Modulus of elasticity E, the stresses acting on the component and elastic strains. If a body is heated to above its crystal recovery temperature, it starts to creep without necessarily reaching its yield point Re. Dislocations and their movements contribute to creep. Dislocations are lattice defects in a crystal. In addition to dislocation movement, vacancy diffusion is another transcrystalline process that causes creep. In the case of diffusion creep, vacancies diffuse through the crystal lattice. Creep processes can cause damage. This must be taken into account when Dimensioning a component. Alloying materials can reduce creep in practice.
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Example sentences:
- In the case of diffusion creep, vacancies diffuse through the crystal lattice.
- Key creep parameters include the creep modulus and the creep value/coefficient .
- If a component's deformation increases under a constant load, the material creeps.
creeping
arrastrado
爬行
蠕变
Description:
蠕变是指材料在保持应力不变的条件下，塑性形变随时间延长而缓慢不断增加的现象。高温下蠕变现象更加显著，因为较高的能量有利于扩散现象。蠕变大小取决于构件的材料性能。关键的蠕变参数包括蠕变模量 ${{E}_{c}}$ 和蠕变值 $\varphi $ 。这些参数取决于材料的弹性模量 E 、作用于构件的应力和弹性应变。 升高物体的温度使其超过晶体的回复温度，就会发生蠕变，而不需要达到它的屈服点 ${{R}_{e}}$ 位错及位错滑移是引起蠕变的原因。位错是晶体的一种晶格缺陷。除了位错滑移之外，空位扩散也是一种可以引起蠕变的穿晶过程。物质穿过晶格空位扩散而产生扩散蠕变。 蠕变过程会导致构件损坏。设计构件尺寸时必须对此充分考虑。 合金材料实际上可以减小蠕变。