Schliff (陽性)

Description: Grinding is a material-removal process that uses a geometrically undefined Cutting tool to process surfaces. Processes include Cylindrical grinding Flat grinding Form grinding Cut-off grinding Eccentric grinding (with rotating tool) Abrasive-band grinding (with endless abrasive band) These processes shape workpieces with high dimensional accuracy, smooth surfaces and define the final contours. Grinding often gives rise to negative rake angles on the grain, which leads to elastic then Plastic deformation of the Material before it is removed. Tools such as grinding wheels and angle grinders or the grinding material contain abrasive grains (such as diamond, corundum, silicon carbide) that must be sufficiently hard, tough and heat-resistant. The grain structure describes the relationship between grain size, bond and pore space (chip space) in the abrasive material. The pores act as chip spaces, take up lubricants and stimulate the removal of chips during the grinding process.